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BSS119 E7978

BSS119 E7978

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    SOT-23

  • 描述:

    MOSFET N-CH 100V 170MA SOT23-3

  • 数据手册
  • 价格&库存
BSS119 E7978 数据手册
BSS119 Rev. 1.3 SIPMOS Small-Signal-Transistor Feature Product Summary • N-Channel VDS • Enhancement mode RDS(on) • Logic Level ID • dv/dt rated 100 V 6 Ω 0.17 A PG-SOT23 3 Drain pin 3 Gate pin1 2 Source pin 2 1 VPS05161 Type Package Pb-free Tape and Reel Information Marking BSS119 PG-SOT23 Yes L6327: 3000 pcs/reel sSH Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Continuous drain current ID Value Unit A TA=25°C 0.17 TA=70°C 0.13 I D puls 0.68 dv/dt 6 Gate source voltage VGS ±20 V Power dissipation Ptot 0.36 W -55... +150 °C Pulsed drain current TA=25°C Reverse diode dv/dt kV/µs IS=0.17A, VDS=80V, di/dt=200A/µs, Tjmax=150°C TA=25°C Operating and storage temperature T j , Tstg IEC climatic category; DIN IEC 68-1 55/150/56 Page 1 2006-12-01 BSS119 Rev. 1.3 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. - - 350 Characteristics Thermal resistance, junction - ambient RthJS K/W at minimal footprint Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. V(BR)DSS 100 - - VGS(th) 1.3 1.8 2.3 Static Characteristics Drain-source breakdown voltage V VGS=0, ID =250µA Gate threshold voltage, VGS = VDS ID=50µA Zero gate voltage drain current µA I DSS VDS=100V, VGS=0, Tj=25°C - 0.05 0.1 VDS=100V, VGS=0, Tj=150°C - 0.5 5 I GSS - 10 100 nA RDS(on) - 4.9 10 Ω RDS(on) - 3.4 6 Gate-source leakage current VGS=20V, VDS=0 Drain-source on-state resistance VGS=4.5V, ID=0.13 A Drain-source on-state resistance VGS=10V, ID=0.17A Page 2 2006-12-01 BSS119 Rev. 1.3 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. 0.08 0.17 - S pF Dynamic Characteristics Transconductance gfs VDS≥2*ID*RDS(on)max, ID=0.13A Input capacitance Ciss VGS=0, VDS=25V, - 60 78 Output capacitance Coss f=1MHz - 8.6 11.2 Reverse transfer capacitance Crss - 3.1 4.1 Turn-on delay time td(on) VDD=50V, VGS=10V, - 2.7 4 Rise time tr ID=0.17A, RG=6Ω - 3.1 4.6 Turn-off delay time td(off) - 9.3 14 Fall time tf - 27 40 - 0.08 0.12 - 0.76 1.1 - 1.67 2.5 V(plateau) VDD =80V, ID = 0.17 A - 3.4 - V IS - - 0.17 A - - 0.68 ns Gate Charge Characteristics Gate to source charge Q gs Gate to drain charge Q gd Gate charge total Qg VDD =80V, ID =0.17A VDD =80V, ID =0.17A, nC VGS =0 to 10V Gate plateau voltage Reverse Diode Inverse diode continuous TA=25°C forward current Inv. diode direct current, pulsed ISM Inverse diode forward voltage VSD VGS=0, IF = IS - 0.8 1.2 V Reverse recovery time trr VR=50V, I F=lS , - 21.7 32.5 ns Reverse recovery charge Qrr diF/dt=100A/µs - 10 15 nC Page 3 2006-12-01 BSS119 Rev. 1.3 1 Power dissipation 2 Drain current Ptot = f (TA) ID = f (TA) parameter: VGS ≥ 10 V 0.38 BSS119 BSS119 0.18 W A 0.32 0.14 0.12 0.24 ID P tot 0.28 0.1 0.2 0.08 0.16 0.12 0.06 0.08 0.04 0.04 0.02 0 0 20 40 60 80 100 120 °C 0 0 160 20 40 60 80 100 120 TA 160 TA 3 Safe operating area 4 Transient thermal impedance ID = f ( VDS ) ZthJA = f (tp ) parameter : D = 0 , TA = 25 °C parameter : D = tp /T 10 °C 1 BSS119 10 3 BSS119 K/W A 10 2 0 /ID ID = RD S n (o V tp = 240.0µs DS Z thJA 10 1 ms ) 10 -1 10 1 10 0 10 ms D = 0.50 0.20 10 -1 0.10 0.05 10 -2 0.02 10 -2 DC 10 -3 0 10 10 1 0.01 single pulse 10 2 V 10 3 VDS 10 -3 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp Page 4 2006-12-01 BSS119 Rev. 1.3 5 Typ. output characteristic 6 Typ. drain-source on resistance ID = f (VDS) RDS(on) = f (ID) parameter: Tj = 25 °C, VGS parameter: Tj = 25 °C, VGS 0.34 12 3.4V 3.8V 4V 4.6V 4.8V 5V 6V 7V 10V Ω 7V 6V 0.28 5V 4.8V 4.6V 0.24 4V 3.8V 0.2 3.4V 10 R DS(on) ID A 10V 9 8 7 6 0.16 5 0.12 4 3 0.08 2 0.04 1 0 0 0.5 1 1.5 2 0 0 3 V 0.04 0.08 0.12 0.16 0.2 0.24 0.28 A ID VDS 7 Typ. transfer characteristics 8 Typ. forward transconductance ID = f ( VGS ); VDS≥ 2 x ID x RDS(on)max gfs = f(ID) parameter: Tj = 25 °C parameter: Tj = 25 °C 0.34 0.3 S A 0.28 0.24 0.22 gfs 0.24 ID 0.34 0.2 0.2 0.18 0.16 0.16 0.14 0.12 0.12 0.1 0.08 0.08 0.06 0.04 0.04 0.02 0 0 0.8 1.6 2.4 3.2 4.4 V VGS Page 5 0 0 0.04 0.08 0.12 0.16 0.2 0.24 0.28 A 0.34 ID 2006-12-01 BSS119 Rev. 1.3 9 Drain-source on-state resistance 10 Typ. gate threshold voltage RDS(on) = f (Tj ) VGS(th) = f (Tj ) parameter : ID = 0.17 A, VGS = 10 V parameter: VGS = VDS ; ID =50µA 24 BSS119 2.6 Ω V 98% 2.2 18 V GS(th) R DS(on) 20 16 14 2 12 1.6 10 1.4 8 98% typ. 1.8 2% 1.2 6 1 4 typ 0.8 2 0 -60 -20 20 60 100 °C 0.6 -60 180 -20 20 60 100 °C 160 Tj Tj 11 Typ. capacitances 12 Forward character. of reverse diode C = f (VDS) IF = f (VSD) parameter: VGS =0, f=1 MHz, Tj = 25 °C parameter: Tj 10 3 10 0 A pF 2 10 -1 Ciss C IF 10 BSS119 Coss 10 1 10 -2 Tj = 25 °C typ Crss Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%) 10 0 0 5 10 15 20 V 30 VDS 10 -3 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VSD Page 6 2006-12-01 BSS119 Rev. 1.3 13 Typ. gate charge 14 Drain-source breakdown voltage VGS = f (QG ); parameter: VDS , V(BR)DSS = f (Tj) ID = 0.17 A pulsed, Tj = 25 °C 16 BSS119 BSS119 120 V V (BR)DSS V V GS 12 10 0.2 VDS max 8 6 114 112 110 108 106 0.5 VDS max 104 0.8 VDS max 102 100 98 4 96 94 2 92 0 0 0.4 0.8 1.2 1.6 2 nC 2.6 QG 90 -60 -20 20 60 100 °C 180 Tj Page 7 2006-12-01 BSS119 Rev. 1.3 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 8 2006-12-01
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